Sintering Mechanical Properties of SiC/nano-Ag/Cu: Molecular Dynamics Simulation
نویسندگان
چکیده
Abstract Nano-sintered silver has broad development prospects in the field of electronic packaging due to its excellent thermal conductivity and feasibility at low sintering temperatures. In this paper, by using molecular dynamics simulations, a single nano-silver particle is sintered, melting temperature range obtained. Then, SiC/nano-Ag/Cu sintered sample prepared. By observing formation process neck, it found that quality can be improved prolonging constant time. Tensile simulations are performed on samples, traction-separation law curve The initial yield strength 3.03 GPa, elastic modulus 28.99 fracture energy 11.74 N/m according curve.
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ژورنال
عنوان ژورنال: Journal of physics
سال: 2022
ISSN: ['0022-3700', '1747-3721', '0368-3508', '1747-3713']
DOI: https://doi.org/10.1088/1742-6596/2381/1/012011